DipChip: Diplomacy and the Semiconductors Supply Chain

We are excited to invite you to participate in CTDP’s DipChip: Diplomacy and the Semiconductors Supply Chain event. This event will take place as part of the Concordia 2021 Annual Summit, on the margin of the UN General Assembly, with specific CTDP event times as follows:

  • September 21, 9:10 am ET, “Technology and Diplomacy,” Hon. Keith Krach, Chair of CTDP Advisory Board, former Under Secretary of State of the United States
  • September 21, 9:20 am ET, “The Future of Semiconductors,” moderated by Dr. Mung Chiang, CTDP Founding Director, Executive Vice President and Engineering Dean of Purdue University, featuring Hon. Bonnie Glick, former Deputy Administrator of the U.S. Agency for International Development, and policy and technology leaders from the U.S. government and major semiconductor companies
  • September 22, 1:15 pm ET, Fireside Chat “Making Chips in America,” Keith Krach and Pat Gelsinger, Intel CEO, with an introduction by Mitch Daniels, Purdue University President

For more information or to register, please email CTDP@prf.org.